Photocatalytic sewage treatment training table

Multi -phase light catalytic reactions have caused people's strong interest. Scientists conduct a lot of research on this, explore the principles of the process, and are committed to improving photocatalytic efficiency. At present, in the semiconductor catalyst used in multi -phase light catalytic reactions, its non -toxic, high catalytic activity, strong oxidation ability, and good stability are commonly used. However, due to the wider gaps, solar energy that can be used only accounts for about 3 % of the total sunlight. In order to improve the utilization rate of solar energy and actively improve catalytic efficiency, people have carried out a lot of research work, such as taking some surface modification modification technologies, designing and developing high -efficiency energy reactors. The use of semiconductor photocatalytic effects can effectively degrade and eliminate harmful pollutants. In recent years, semiconductor multi -phase light catalysis has been increasingly valued as a new pollution control technology. It has many literature reports in the application potential of wastewater treatment. A large number of studies have confirmed that dyes, surfactants, organic halide, pesticides, oil, cyanide, etc. can effectively perform photocatalytic reactions. Essence At present, the research work in the basic theory and practical application of photocatalytic at home and abroad has been reported in large numbers. This article has made this article in recent years in the research progress of photocatalytic reactions and its research in wastewater treatment.

2. Technical indicators and parameters:

1. Environmental temperature: 5 ℃ ～ 40 ℃;

2. Treatment of water: 10 ～ 20L/h;

3. Aeseum: HRT = 5.6H;

4. UV sterilization light: ø 20mm × 500mm

5. Optical catalytic reaction column: 化 100mm × 700mm;

6. Total size 1000 × 450 × 1300 mm

7. Work power: AC220V ± 10%, 50Hz, single -phase three -line system, 500W power, safety protection: ground protection, leakage protection, overcurrent protection

1. Core board hardware parameters

 

1.1CPU: OMAP3530 DCUS, 600-MHz ARM Cortex-A8 Core 412-MHZ TMS320C64X+ DSP Core, integrated memory for ARM CPU (16KB I-Cache, 16KB D-Cache, 256kb L2) and chip storage (64KB SRA M, 112KB ROM Cure

 

1.2DDR RAM: 256MB DDR RAM MT29C2G48MAKLCJA-6IT

 

1.3Flash: 256MB NAND Flash MT29C2G48maklcja-6IT

 

1.4 Power Management: Independent Power Management Chip TPS65930

 

1.5LDO: With LDO

 

2. Belly hardware parameter

 

2.1fpga: XC3S250E-P208 is used to control logic and expand serial ports, allocate the corresponding device allocation address

 

2.2 Ethernet: 1 10/100M adaptive Ethernet controller DM9000A

 

2.3LED: 12 GPIO -controlled LED working status instructions: 6 are located on the core board, 6 are located on the bottom board

 

2.4 Audio: Standard AC97 Audio Controller Small Three Core interface+MIC head TPS65930

 

2.5 reset: isolated internal and external reset signals, increase reset reliability TC7SH08FU

 

2.6UART: A total of 7 UART: 3 processor comes with it, 4th road FPGA expansion, of which 1 connecting infrared 2 -way expansion interface 4 road connection DB9 connector